Official announcement: 2025 Shanghai Semiconductor Industry and Application Expo

COTV GLOBAL LIVE

2025 China Semiconductor Industry and Application Expo

Date: November 5-7, 2025 Location: Shanghai New International Expo Center

[Organizational Structure]

Guiding unit: Ministry of Industry and Information Technology of the People's Republic of China

Ministry of Commerce of the People's Republic of China

Host: China Electronics Equipment Co., Ltd

Shanghai Integrated Circuit Industry Association

Co organizer: Beijing Dayi Exhibition Co., Ltd

Execution unit: Duande Exhibition (Shanghai) Co., Ltd

The semiconductor industry has become the high ground of strategic competition among major countries around the world.

Chips, as the heart of modern industry and the cornerstone of information technology, play a crucial role in both new industrialization, network power, and digital China; Semiconductors have become the foundation of the national struggle, representing a comprehensive strength competition at the national level. As China's development in the high-tech field increasingly reflects the national strategic will, the future chip industry will be driven more by the power of state-owned will. To resolutely win the battle against key core technologies, China's semiconductor industry should still strengthen originality and leadership in research and development, and continue to collaborate and overcome difficulties in the bottleneck areas.

The Chinese semiconductor industry has risen against the trend.

With China's significant investment in technologies such as 5G, AI, IoT, cloud computing, and big data, the "new infrastructure" represented by 5G networks, industrial Internet of Things, and others will drive the high-speed growth of the semiconductor industry.

It is predicted that the semiconductor market supply in China will reach 538.5 billion by 2030

The US dollar remains the largest in the world, with 69% of consumption coming from domestic Chinese companies, and demand mainly coming from application fields such as data centers, consumer electronics, automotive, and healthcare. Driven by the support of national policies and downstream market demands such as the Internet of Things, intelligent driving, new energy vehicles, intelligent terminal manufacturing, and new generation mobile communication, the market size of China's semiconductor industry has significantly increased.

The Pearl River Delta and Yangtze River Delta are the regions with the most solid foundation, complete industrial chain, and advanced technology in China's semiconductor industry.

As a major province in electronic information, Guangdong has inherent advantages in vigorously developing the semiconductor industry. The integrated circuit industry in Guangdong Province is gradually maturing, and third-generation semiconductors have become a highlight. Shenzhen and Guangzhou, as the main cities of the semiconductor industry, along with nine Pearl River Delta cities including Zhuhai, Foshan, Huizhou, Dongguan, Zhongshan, Jiangmen, and Zhaoqing, are making strong efforts to build a semiconductor and integrated circuit industry cluster with international influence. From the perspective of the industrial chain, the Pearl River Delta region is highly concentrated with Huawei, ZTE OPPO、vivo、 A group of globally influential terminal manufacturers such as BYD, CSR, and DJI have provided rich downstream application scenarios for the development of their third-generation semiconductors.

The Yangtze River Delta region, led by Shanghai, has gathered numerous semiconductor companies and boasts strong semiconductor industry cities such as Shanghai, Wuxi, Hangzhou, Hefei, Nanjing, and Suzhou. The industrial chain is complete and the industrial aggregation effect is good. The Yangtze River Delta region relies on its unique geographical location, policies, talent, technology, and other factors

Advantages: The scale of the integrated circuit industry continues to grow. Shanghai has obvious comprehensive competitive advantages in integrated circuit design and manufacturing, with chip manufacturing and design as the main driving force, and equipment raw materials and packaging developing in synergy.

Jiangsu has a complete integrated circuit industry chain and strong supporting capabilities. Its chip design and manufacturing capabilities have improved rapidly, and the output value of the packaging and testing industry accounts for half of the country's total. Zhejiang's emerging integrated circuit design enterprises are accelerating their agglomeration, with obvious advantages in areas such as silicon material production, special process chip manufacturing, and industry applications. Anhui's characteristic industries such as new displays, storage chips, driver chips, and home appliance chips have developed rapidly, with relatively prominent cost advantages.

The China Semiconductor Industry and Application Expo (IC EXPO) is driven by both the Shenzhen and Shanghai wings.

In order to further strengthen exchanges and cooperation in the semiconductor industry, accelerate breakthroughs in key core semiconductor technologies, and effectively promote the coordinated development of the semiconductor industry chain, the organizer of the China Electronics Show, which began in 1964, has launched the China Semiconductor Industry and Application Expo (IC Expo) based on the strong resource advantages of the industry and the successful hosting of the 100th China Electronics Show and the 10th China Electronics Information Expo.

The IC Expo is held in Shenzhen in April and Shanghai in November every year, in conjunction with the China Electronics Fair Spring and Autumn Meetings, to facilitate efficient collaboration between industry, academia, and research in the semiconductor industry, and to strengthen, supplement, and extend the semiconductor industry chain in the Pearl River Delta and Yangtze River Delta regions.

[Scope of Exhibition]

Chip design/wafer manufacturing:

Integrated circuit design and chips EDA、MCU、 Wafer manufacturing and equipment and components, etc;

Advanced packaging:

Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc;

Semiconductor specialized equipment/components:

Thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc;

Advanced materials/carbon materials/diamond semiconductors:

Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc;

Compounds and third-generation semiconductors:

Nitriding (GaN) and silicon carbide (SiC), zinc oxide (ZnO) diamond, wafers, substrates and epitaxy, power devices, IGBT packaging materials, RF devices and processing equipment, etc;

Power devices/automotive semiconductors:

Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc;

Encapsulation of computing power, storage, artificial intelligence, and CPO:

Artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc;

Semiconductor Empowerment Hotspot Applications and Solutions:

Automotive electronics, specialty electronics, 5G, AI, IoT scenario applications, IoT, motor drive, industrial control, etc.

Exhibition fees

Booth type: Standard booth, Double booth, Indoor bare space (starting from 36 square meters), Overseas enterprises

Exhibition fee: ¥ 15000/9 ㎡ ¥ 16000/9 ㎡ ¥ 1500/㎡ $2500/9 ㎡

Note 1: Basic configuration of standard booth: (length 3 meters x width 3 meters x height 2.5 meters), three sided fence (white), company Chinese and English fascia board, one power socket (within 500W), two fluorescent lamps, one consultation desk, two folding chairs, carpet, garbage bin, etc.

Note 2: The vacant booth does not come with any facilities and will be designed and decorated by exhibitors themselves or commissioned for design and decoration.

If you want to book a booth at the "2025 China Semiconductor Exhibition" and learn more information, please contact us through the following contact information:

2025 China Semiconductor Industry and Application Expo

Contact: Mr. Xu 187 1786 8938 (same as WeChat)